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| LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only TAPE AND BOX TYPE LED LAMPS LDBK3333/H0/TBS DATA SHEET DOC. NO : REV. DATE : : QW0905- LDBK3333/H0/TBS C 11 - Aug - 2005 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LDBK3333/H0/TBS Page 1/5 Package Dimensions P2 G H H2 H1 L W0 W2 W1 W3 D P1 F P T LDBK3333/H0 5.0 5.9 7.6 8.6 1.5MAX 25.0MIN 1/4 0.5 TYP 2.54TYP 1.0MIN +Note : 1.All dimension are in millimeter tolerance is O 0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LDBK3333/H0/TBS Page 2/5 Absolute Maximum Ratings at Ta=25 J Ratings Parameter Symbol DBK Forward Current Peak Forward Current Duty 1/10@10KHz Power Dissipation Reverse Current @5V Electrostatic Discharge Operating Temperature Storage Temperature Soldering Temperature IF IFP PD Ir ESD Topr Tstg Tsol 30 100 120 50 150 -20 ~ +80 -30 ~ +100 Max 260J for 5 sec Max (2mm from body) mA mA mW UNIT g A V J J Typical Electrical & Optical Characteristics (Ta=25 J ) PART NO MATERIAL Emitted COLOR Lens Water Clear Luminous Dominant Spectral Forward voltage intensity wave halfwidth length f nm @20mA(V) @20mA(mcd) f Dnm Typ. Max. Min. Typ. Viewing angle 2c 1/2 (deg) LDBK3333/H0/TBS InGaN/GaN Blue 470 30 3.5 4.0 1500 2700 26 Note : 1.The forward voltage data did not including O 0.1V testing tolerance. 2. The luminous intensity data did not including O 15% testing tolerance. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LDBK3333/H0/TBS Page 3/5 E Dimension Symbol Information mm Tape Feed Hole Diameter Component Lead Pitch Front-To-Rear Deflection ------------------ inch 0.15 0.09 ------- mm 4.2 3.0 2.0 18.5 22.5 26.5 23.5 20.9 25.0 25.5 20.0 19.4 36 11 inch 0.17 0.12 0.08 0.73 0.89 1.04 0.93 0.82 0.98 1.0 0.79 0.76 1.42 0.43 0.51 0.23 0.3 0.06 0.38 0.61 0.16 0.75 D F 3.8 2.3 ------- H TBS-1 TBS-2 Feed Hole To Bottom Of Component TBS-3 TBS-5 TBS-6 TBS-7 TBS-8 TBS-9 TBS-10 Feed Hole To Overall Component Height Lead Length After Component Height Feed Hole Pitch Lead Location Center Of Component Location Overall Taped Package Thickness Feed Hole Location Adhesive Tape Width Adhesive Tape Position Tape Width ------------------------------------------------------------- 17.5 21.5 25.5 22.5 19.9 H1 24.0 24.5 19.0 18.4 H2 L P P1 P2 T W0 W1 W2 W3 12.4 4.4 5.1 ------------- 0.69 0.85 1.0 0.89 0.78 0.94 0.96 0.75 0.72 ------- W0 0.49 0.17 0.2 ------- 13 5.8 7.7 1.42 9.75 15.5 4.0 19 8.5 14.5 0 17.5 0.33 0.57 0 0.69 E REMARK:TBS = Tape And Box Straight Leads E Dimensions Symbol Information Specification Symbol E Package Dimensions minimum mm inch 13.0 10.4 1.97 maxmum mm 340 275 60 inch 13.4 10.8 2.4 W L Overall Length Overall Width Overall Thickness L W H 330 265 50 H Part No. LDBK3333/H0 Quantity/Box 2000PCS LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LDBK3333/H0/TBS Page 4/5 Typical Electro-Optical Characteristics Curve DBK CHIP Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current 3.0 1000 Forward Current(mA) 100 10 1 01 1.0 2.0 3.0 4.0 5.0 Relative Intensity Normalize @20mA 2.5 2.0 1.5 1.0 0.5 0.0 1 10 100 1000 Forward Voltage(V) Fig.3 Forward Voltage vs. Temperature Forward Current(mA) Fig.4 Relative Intensity vs. Temperature Forward Voltage@20mA Normalize @25J Relative Intensity@20mA Normalize @25J -40 -20 0 20 40 60 80 100 1.2 3.0 2.5 2.0 1.5 1.0 0.5 0.0 -40 -20 0 20 40 60 80 100 1.1 1.0 0.9 0.8 Ambient Temperature(J ) Ambient Temperature(J ) Fig.5 Relative Intensity vs. Wavelength Fig.6 Directivity Radiation 0X -30X 30X Relative Intensity@20mA 1.0 -60X 0.5 60X 0.0 400 450 500 550 100% 75% 50% 25% 0 25% 50% 75% 100% Wavelength (nm) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. L LDBK3333/H0/TBS Page 5/5 Reliability Test: Test Item Test Condition 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) Description This test is conducted for the purpose of detemining the resisance of a part in electrical and themal stressed. Reference Standard MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 Operating Life Test High Temperature Storage Test 1.Ta=105 JO 5J 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under ondition of hogh temperature for hours. MIL-STD-883:1008 JIS C 7021: B-10 Low Temperature Storage Test 1.Ta=-40 JO 5J 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. JIS C 7021: B-12 High Temperature High Humidity Test 1.Ta=65 JO 5J 2.RH=90 %~95% 3.t=240hrs O 2hrs The purpose of this test is the resistance of the device under tropical for hous. MIL-STD-202:103B JIS C 7021: B-11 Thermal Shock Test 1.Ta=105 JO 5J &-40JO (10min) (10min) 2.total 10 cycles 5J The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 Solder Resistance Test 1.T.Sol=260 J O 5J 2.Dwell time= 10 O 1sec. MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 Solderability Test 1.T.Sol=230 J O 5J 2.Dwell time=5 O 1sec This test intended to see soldering well performed or not. MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 |
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